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Title | MAM 2017 - Materials for advanced |
Description | Fraunhofer Institute for Electronic Nano Search Fraunhofer Institute for Electronic Nano Systems Fraunhofer Institute for Electronic Nano Systems Fraunhofer-Gesellschaft MAM2018 MAM [X] MAM past |
Keywords | N/A |
WebSite | mam-conf.org |
Host IP | 192.102.162.236 |
Location | Germany |
Site | Rank |
US$1,592
Last updated: 2023-05-13 19:26:09
mam-conf.org has Semrush global rank of 0. mam-conf.org has an estimated worth of US$ 1,592, based on its estimated Ads revenue. mam-conf.org receives approximately 183 unique visitors each day. Its web server is located in Germany, with IP address 192.102.162.236. According to SiteAdvisor, mam-conf.org is safe to visit. |
Purchase/Sale Value | US$1,592 |
Daily Ads Revenue | US$1 |
Monthly Ads Revenue | US$44 |
Yearly Ads Revenue | US$529 |
Daily Unique Visitors | 12 |
Note: All traffic and earnings values are estimates. |
Host | Type | TTL | Data |
mam-conf.org. | A | 86399 | IP: 192.102.162.236 |
mam-conf.org. | NS | 86400 | NS Record: z.ns.joker.com. |
mam-conf.org. | NS | 86400 | NS Record: y.ns.joker.com. |
mam-conf.org. | NS | 86400 | NS Record: x.ns.joker.com. |
mam-conf.org. | MX | 7200 | MX Record: 10 mail.joker.com. |
Search Fraunhofer Institute for Electronic Nano Systems Fraunhofer Institute for Electronic Nano Systems Fraunhofer-Gesellschaft MAM2018 MAM [X] MAM past conferences Topics & Committee Conference program [X] Conference program Postersession Venue [X] Venue Venue Hotel Accomodation City information Contact MAM2018 More © Frank Exß DML BY MAM 2017 will be the 26 th in a series devoted to research on materials properties and interactions of interconnect and silicide materials. The objective of the conference is to provide a forum for open discussions across fundamental and applied sciences and industrial applications. It is dedicated to international material scientists, process and integration engineers and students, and historically had attendees from universities, research institutions and industries. To meet the progressive downscaling of device dimensions and the demand for more functionality, the challenges fall to material solutions. New and extensive materials research is needed |
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